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- Publisher
- Springer Journals
- Copyright
- Copyright © Pleiades Publishing, Ltd. 2022. ISSN 1061-8309, Russian Journal of Nondestructive Testing, 2022, Vol. 58, No. 1, pp. 10–22. © Pleiades Publishing, Ltd., 2022. Russian Text © The Author(s), 2022, published in Defektoskopiya, 2022, No. 1, pp. 13–25.
- ISSN
- 1061-8309
- eISSN
- 1608-3385
- DOI
- 10.1134/s1061830922010028
- Publisher site
- See Article on Publisher Site
Abstract
We consider the possibility of diagnosing and predicting the reliability of semiconductor products both by the parameters of their eigen low-frequency (LF) noise and by the combined testing parameters, e.g., by the measured LF noise during electrostatic discharge and (or) thermal annealing and describe practical methods for implementation of such a possibility are described. Estimates of the reliability of the considered methods are presented. It is shown that the reliability of combined tests approaches unity.
Journal
Russian Journal of Nondestructive Testing – Springer Journals
Published: Jan 1, 2022
Keywords: integrated circuit; quality; reliability; low-frequency noise; diagnostics; prediction