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Simulations of Mechanical Behavior of Polycrystalline Copper with Nano-Twins

Simulations of Mechanical Behavior of Polycrystalline Copper with Nano-Twins Abstract Mechanical behavior and microstructure evolution of polycrystalline copper with nano-twins were investigated in the present work by finite element simulations. The fracture of grain boundaries are described by a cohesive interface constitutive model based on the strain gradient plasticity theory. A systematic study of the strength and ductility for different grain sizes and twin lamellae distributions is performed. The results show that the material strength and ductility strongly depend on the grain size and the distribution of twin lamellae microstructures in the polycrystalline copper. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png "Acta Mechanica Solida Sinica" Springer Journals

Simulations of Mechanical Behavior of Polycrystalline Copper with Nano-Twins

"Acta Mechanica Solida Sinica" , Volume 21 (3): 9 – Jun 1, 2008

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References (31)

Publisher
Springer Journals
Copyright
2008 The Chinese Society of Theoretical and Applied Mechanics and Technology
ISSN
0894-9166
eISSN
1860-2134
DOI
10.1007/s10338-008-0822-5
Publisher site
See Article on Publisher Site

Abstract

Abstract Mechanical behavior and microstructure evolution of polycrystalline copper with nano-twins were investigated in the present work by finite element simulations. The fracture of grain boundaries are described by a cohesive interface constitutive model based on the strain gradient plasticity theory. A systematic study of the strength and ductility for different grain sizes and twin lamellae distributions is performed. The results show that the material strength and ductility strongly depend on the grain size and the distribution of twin lamellae microstructures in the polycrystalline copper.

Journal

"Acta Mechanica Solida Sinica"Springer Journals

Published: Jun 1, 2008

Keywords: Theoretical and Applied Mechanics; Surfaces and Interfaces, Thin Films; Classical Mechanics

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