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Norbornene end-capped polyimide for low CTE and low residual stress with changes in the diamine linkages

Norbornene end-capped polyimide for low CTE and low residual stress with changes in the diamine... Abstract The effects of norbornene (NE) crosslinking and diamine bridge linkages (ether, sulfone, and trifluoromethyl) on polyimide films were investigated. The purpose of this study was to study the behavior of the NE endcapped polyimide with different diamine bridge linkage structure at elevated temperatures on residual stress and modulus change. 5-Norbornene-2,3-dicarboxylic acid was introduced as the end-capping agent in order to increase the ratio of crosslinking in the structure through reverse Diels-Alder reaction. Wide angle X-ray diffraction (WAXD) was measured to study the relation of d-spacing and structure change of the bridge linkage of polymers through NE crosslinking. Coefficient of thermal expansion (CTE) and residual stress were measured to confirm the loaded stress between the substrate and polymer film through a thin film stress analyzer (TFSA). Storage (ε′) and loss modulus (ε″) were studied at elevated temperatures to study the relation of bridge linkage mobility of the polyimide at elevated temperature. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png "Macromolecular Research" Springer Journals

Norbornene end-capped polyimide for low CTE and low residual stress with changes in the diamine linkages

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References (36)

Publisher
Springer Journals
Copyright
2015 The Polymer Society of Korea and Springer Sciene+Business Media Dordrecht
ISSN
1598-5032
eISSN
2092-7673
DOI
10.1007/s13233-015-3104-3
Publisher site
See Article on Publisher Site

Abstract

Abstract The effects of norbornene (NE) crosslinking and diamine bridge linkages (ether, sulfone, and trifluoromethyl) on polyimide films were investigated. The purpose of this study was to study the behavior of the NE endcapped polyimide with different diamine bridge linkage structure at elevated temperatures on residual stress and modulus change. 5-Norbornene-2,3-dicarboxylic acid was introduced as the end-capping agent in order to increase the ratio of crosslinking in the structure through reverse Diels-Alder reaction. Wide angle X-ray diffraction (WAXD) was measured to study the relation of d-spacing and structure change of the bridge linkage of polymers through NE crosslinking. Coefficient of thermal expansion (CTE) and residual stress were measured to confirm the loaded stress between the substrate and polymer film through a thin film stress analyzer (TFSA). Storage (ε′) and loss modulus (ε″) were studied at elevated temperatures to study the relation of bridge linkage mobility of the polyimide at elevated temperature.

Journal

"Macromolecular Research"Springer Journals

Published: Aug 1, 2015

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