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Yueguang Deng, Jing Liu, Yi-xin Zhou (2009)
Liquid Metal Based Mini/Micro Channel Cooling Device
C. Lu, C. Pan (2011)
Convective boiling in a parallel microchannel heat sink with a diverging cross section and artificial nucleation sitesExperimental Thermal and Fluid Science, 35
V. Talimi, Y. Muzychka, S. Kocabiyik (2012)
A review on numerical studies of slug flow hydrodynamics and heat transfer in microtubes and microchannelsInternational Journal of Multiphase Flow, 39
(2002)
A computer chip cooling device using liquid metal with low melting point and its alloys as the cooling fluid
A. Miner, U. Ghoshal (2004)
Cooling of high-power-density microdevices using liquid metal coolantsApplied Physics Letters, 85
Ravi Arora, A. Tonkovich, M. Lamont, Tom Yuschak, Laura Silva (2007)
Passive Heat Transfer Enhancement in Microchannels Using Wall Features
Kunquan Ma, Liu Jing (2007)
Liquid metal cooling in thermal management of computer chipsFrontiers in energy, 1
Akademii︠a︡ Sssr (1939)
Journal of physics
R. Wilcoxon, N. Lower, D. Dlouhý (2010)
A compliant thermal spreader with internal liquid metal cooling channels2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM)
Yueguang Deng, Jing Liu (2010)
A liquid metal cooling system for the thermal management of high power LEDsInternational Communications in Heat and Mass Transfer, 37
W. Qu, I. Mudawar (2004)
Measurement and correlation of critical heat flux in two-phase micro-channel heat sinksInternational Journal of Heat and Mass Transfer, 47
R. Shah (1975)
Laminar flow friction and forced convection heat transfer in ducts of arbitrary geometryInternational Journal of Heat and Mass Transfer, 18
Ningli Liu, R. Chevray, G. Domoto, E. Panides (2005)
Numerical Computation of Fluid Flow and Heat Transfer in Microchannels
W. Qu, I. Mudawar, Sangyoup Lee, S. Wereley (2006)
Experimental and Computational Investigation of Flow Development and Pressure Drop in a Rectangular Micro-channelJournal of Electronic Packaging, 128
Y. Muzychka, E. Walsh, P. Walsh (2010)
Simple Models for Laminar Thermally Developing Slug Flow in Noncircular Ducts and ChannelsJournal of Heat Transfer-transactions of The Asme, 132
Thanhtrung Dang, J. Teng (2010)
Influence of Flow Arrangement on the Performance of an Aluminium Microchannel Heat Exchanger, 1285
Yi-xin Zhou (2009)
Experimental study on liquid metal cooling for LED lightJournal of Optoelectronics·laser
D. Lelea, Catalin Nisulescu (2011)
The micro-tube heat transfer and fluid flow of water based Al2O3 nanofluid with viscous dissipation ☆International Communications in Heat and Mass Transfer, 38
Yueguang Deng, Jing Liu (2009)
Corrosion development between liquid gallium and four typical metal substrates used in chip cooling deviceApplied Physics A, 95
A. Bergles (2003)
Evolution of cooling technology for electrical, electronic, and microelectronic equipmentIEEE Transactions on Components and Packaging Technologies, 26
K. Toh, X. Chen, J. Chai (2002)
Numerical computation of fluid flow and heat transfer in microchannelsInternational Journal of Heat and Mass Transfer, 45
Kunquan Ma, Jing Liu (2007)
Heat-driven liquid metal cooling device for the thermal management of a computer chipJournal of Physics D: Applied Physics, 40
S. Kakaç, R. Shah, W. Aung (1987)
Handbook of single-phase convective heat transfer
Kunquan Ma, Jing Liu, Shi-Hai Xiang, K. Xie, Yi Zhou (2009)
Study of thawing behavior of liquid metal used as computer chip coolantInternational Journal of Thermal Sciences, 48
K. Vafai, A. Khaled (2011)
COOLING AUGMENTATION USING MICROCHANNELS WITH ROTATABLE SEPARATING PLATESInternational Journal of Heat and Mass Transfer, 54
Mesbah Khan, A. Fartaj (2011)
A review on microchannel heat exchangers and potential applicationsInternational Journal of Energy Research, 35
Jaeseon Lee, I. Mudawar (2007)
Assessment of the effectiveness of nanofluids for single-phase and two-phase heat transfer in micro-channelsInternational Journal of Heat and Mass Transfer, 50
R. Prasher, Je-Young Chang (2008)
COOLING OF ELECTRONIC CHIPS USING MICROCHANNEL AND MICRO-PIN FIN HEAT EXCHANGERS
M. Tawk, Yvan Avenas, A. Lebouc, M. Petit (2011)
Numerical study of a liquid metal mini-channel cooler for power semiconductor devices2011 17th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
K. Triplett, S. Ghiaasiaan, S. Abdel-Khalik, A. LeMouel, B. McCord (1999)
Gas–liquid two-phase flow in microchannels: Part II: void fraction and pressure dropInternational Journal of Multiphase Flow, 25
J. Hwang, F. Tseng, C. Pan (2005)
Ethanol–CO2 two-phase flow in diverging and converging microchannelsInternational Journal of Multiphase Flow, 31
W. Chen, M. Twu, C. Pan (2002)
Gas-liquid two-phase flow in micro-channelsInternational Journal of Multiphase Flow, 28
R Prasher (2008)
Cooling of electronic chips using microchannel and micro-fin heat exchangers. In: Proceedings of International Conference on Nanochannels, Microchannels, MinichannelsProceedings of International Conference on Nanochannels
Abstract There is currently a growing demand for developing efficient techniques for cooling integrated electronic devices with ever increasing heat generation power. To better tackle the high-density heat dissipation difficulty within the limited space, this paper is dedicated to clarify the heat transfer behaviors of the liquid metal flowing in mini-channel exchangers with different geometric configurations. A series of comparative experiments using liquid metal alloy Ga68%In20%Sn12% as coolant were conducted under prescribed mass flow rates in three kinds of heat exchangers with varied geometric sizes. Meanwhile, numerical simulations for the heat exchangers under the same working conditions were also performed which well interpreted the experimental measurements. The simulated heat sources were all cooled down by these three heat dissipation apparatuses and the exchanger with the smallest channel width was found to have the largest mean heat transfer coefficient at all conditions due to its much larger heat transfer area. Further, the present work has also developed a correlation equation for characterizing the Nusselt number depending on Peclet number, which is applicable to the low Peclet number case with constant heat flux in the hydrodynamically developed and thermally developing region in the rectangular channel. This study is expected to provide valuable reference for designing future liquid metal based mini-channel heat exchanger.
"Frontiers in Energy" – Springer Journals
Published: Dec 1, 2013
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