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Enhancement of transient heat transfer at boiling on a plate surface with low thermoconductive coatings

Enhancement of transient heat transfer at boiling on a plate surface with low thermoconductive... Abstract An experimental study of transient cooling in liquid nitrogen of strongly overheated copper plate coated with a low thermoconductive coating with thickness δ from 0.09 to 0.67 mm was performed. It is shown that the low thermoconductive coating has a significant effect on the character of temperature curves and total time of plate cooling. It was revealed that the most significant decrease in the time of plate cooling by the factor of 2.6 is achieved for the thickness of the low thermoconducting layer of 0.09 mm as compared to the case without coating. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Thermophysics and Aeromechanics Springer Journals

Enhancement of transient heat transfer at boiling on a plate surface with low thermoconductive coatings

Thermophysics and Aeromechanics , Volume 22 (6): 6 – Nov 1, 2015

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Publisher
Springer Journals
Copyright
2015 Pleiades Publishing, Ltd.
ISSN
0869-8643
eISSN
1531-8699
DOI
10.1134/S0869864315060062
Publisher site
See Article on Publisher Site

Abstract

Abstract An experimental study of transient cooling in liquid nitrogen of strongly overheated copper plate coated with a low thermoconductive coating with thickness δ from 0.09 to 0.67 mm was performed. It is shown that the low thermoconductive coating has a significant effect on the character of temperature curves and total time of plate cooling. It was revealed that the most significant decrease in the time of plate cooling by the factor of 2.6 is achieved for the thickness of the low thermoconducting layer of 0.09 mm as compared to the case without coating.

Journal

Thermophysics and AeromechanicsSpringer Journals

Published: Nov 1, 2015

References