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Abstract The effect of through-thickness reinforcement by composite pins (Z-pins) on the static tensile strength and failure mechanisms of the joints made from ceramic matrix composite (CMC) is investigated. Overlap length of the single lap joint is 15 mm, 20 mm, 23 mm, 37 mm, and 60 mm, respectively. The experimental results indicate that the final failure modes of the joints can be divided into two groups, (a) the bond-line stops debonding until crack encounters Z-pins; and then the adherends break at the location of Z-pins, when overlap length is more than 20 mm; (b) the bond-line detaches entirely and Z-pins are drawn from adherends, when overlap length is equal to 15 mm. A simple efficient computational approach is presented for analyzing the benefit of through-thickness pins for restricting failure in the single lap joints. Here, the mechanics problem is simplified by representing the effect of the pins by tractions acting on the fracture surfaces of the cracked bond-line. The tractions are prescribed as functions of the crack displacement, which are available in simple forms that summarize the complex deformations to a reasonable accuracy. The resulting model can be used to track the evolution of complete failure mechanisms, for example, bond-line initial delamination and ultimate failure associated with Z-pin pullout, ultimate failure of the adherends. The paper simulates connecting performance of the single lap joints with different Z-pins’ diameter, spacing and overlap length; the numerical results agree with the experimental results; the numerical results indicate enlarging diameter and decreasing spacing of Z-pins are in favor of improving the connecting performance of the joints. By numerical analysis method, the critical overlap length that lies between two final failure modes is between 18 mm and 19 mm, when Z-pins’ diameter and spacing are 0.4 mm, 5 mm, respectively.
"Acta Mechanica Solida Sinica" – Springer Journals
Published: Oct 1, 2008
Keywords: Theoretical and Applied Mechanics; Surfaces and Interfaces, Thin Films; Classical Mechanics
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