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Effects of the sequential implantation of Mg and N ions into GaN for p-type doping

Effects of the sequential implantation of Mg and N ions into GaN for p-type doping The sequential implantation of Mg and N ions into GaN was investigated using conventional rapid thermal annealing and ultra-high-pressure annealing (UHPA). In cathodoluminescence, the green luminescence related to nitrogen vacancies (VNs) was mostly suppressed at the Mg/N ratio of 0.5–1.0, whereas the donor–acceptor pair (DAP) emission as a signature of Mg acceptors was maintained high. The excess N implantation reduced the DAP emission through the formation of nonradiative recombination centers. The combined process of optimal Mg/N implantation and UHPA at 1673 K improved ohmic contacts by increasing Mg concentration and suppressing VNs near the surface. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Applied Physics Express IOP Publishing

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Publisher
IOP Publishing
Copyright
© 2021 The Japan Society of Applied Physics
ISSN
1882-0778
eISSN
1882-0786
DOI
10.35848/1882-0786/ac2ae7
Publisher site
See Article on Publisher Site

Abstract

The sequential implantation of Mg and N ions into GaN was investigated using conventional rapid thermal annealing and ultra-high-pressure annealing (UHPA). In cathodoluminescence, the green luminescence related to nitrogen vacancies (VNs) was mostly suppressed at the Mg/N ratio of 0.5–1.0, whereas the donor–acceptor pair (DAP) emission as a signature of Mg acceptors was maintained high. The excess N implantation reduced the DAP emission through the formation of nonradiative recombination centers. The combined process of optimal Mg/N implantation and UHPA at 1673 K improved ohmic contacts by increasing Mg concentration and suppressing VNs near the surface.

Journal

Applied Physics ExpressIOP Publishing

Published: Nov 1, 2021

Keywords: GaN; Mg implantation; N implantation; GaN power devices; ultra-high-pressure annealing

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