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- Publisher
- Inderscience Publishers
- Copyright
- Copyright © Inderscience Enterprises Ltd. All rights reserved
- ISSN
- 1753-0822
- eISSN
- 1753-0830
- DOI
- 10.1504/IJSEM.2012.050940
- Publisher site
- See Article on Publisher Site
Abstract
This study aims to identify the key components of TQM practices in a Malaysian semiconductor manufacturing firm and determine their effects on the firm’s engineering performance. A review was first conducted on the components of TQM practices. Surveys were then distributed to the engineers of the firm. After collecting 226 survey responses, data reduction was conducted using reliability and factor analysis. The components were reduced to four underlying components. The relationship between these components and engineering performance was tested using correlations and multiple linear regression analysis. It was found that all components have a positive and significant relationship with engineering performance, with organisational continuous improvement having the strongest correlation. The major success of TQM practices in this firm came from productive teamwork, synergy and support from all engineers. This study provides an exemplary guideline for most Malaysian semiconductor firms to refine their focus in TQM practices for improved engineering performance.
Journal
International Journal of Services, Economics and Management – Inderscience Publishers
Published: Jan 1, 2012