Get 20M+ Full-Text Papers For Less Than $1.50/day. Start a 14-Day Trial for You or Your Team.

Learn More →

Thermal Stress of Surface of Mold Cavities and Parting Line of Silicone Molds

Thermal Stress of Surface of Mold Cavities and Parting Line of Silicone Molds Abstract The paper is focused on the study of thermal stress of surface of mold cavities and parting line of silicone molds after pouring. The silicone mold White SD - THT was thermally stressed by pouring of ZnAl4Cu3 zinc alloy with pouring cycle 20, 30 and 40 seconds. The most thermally stressed part of surface at each pouring cycle is gating system and mold cavities. It could be further concluded that linear increase of the pouring cycle time leads to the exponential increasing of the maximum temperature of mold surface after its cooling. The elongated pouring cycle increases the temperature accumulated on the surface of cavities and the ability of silicone mold to conduct the heat on its surface decreases, because the low thermal conductivity of silicone molds enables the conduction of larger amount of heat into ambient environment. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Research Papers Faculty of Materials Science and Technology Slovak University of Technology de Gruyter

Thermal Stress of Surface of Mold Cavities and Parting Line of Silicone Molds

Loading next page...
 
/lp/de-gruyter/thermal-stress-of-surface-of-mold-cavities-and-parting-line-of-rrm41LbV0G

References (8)

Publisher
de Gruyter
Copyright
Copyright © 2014 by the
ISSN
1338-0532
eISSN
1338-0532
DOI
10.2478/rput-2014-0021
Publisher site
See Article on Publisher Site

Abstract

Abstract The paper is focused on the study of thermal stress of surface of mold cavities and parting line of silicone molds after pouring. The silicone mold White SD - THT was thermally stressed by pouring of ZnAl4Cu3 zinc alloy with pouring cycle 20, 30 and 40 seconds. The most thermally stressed part of surface at each pouring cycle is gating system and mold cavities. It could be further concluded that linear increase of the pouring cycle time leads to the exponential increasing of the maximum temperature of mold surface after its cooling. The elongated pouring cycle increases the temperature accumulated on the surface of cavities and the ability of silicone mold to conduct the heat on its surface decreases, because the low thermal conductivity of silicone molds enables the conduction of larger amount of heat into ambient environment.

Journal

Research Papers Faculty of Materials Science and Technology Slovak University of Technologyde Gruyter

Published: Jun 1, 2014

There are no references for this article.