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Transport-Layer-Assisted Routing for Runtime Thermal Management of 3D NoC Systems CHIH-HAO CHAO, KUN-CHIH CHEN, TSU-CHU YIN, SHU-YEN LIN, and AN-YEU (ANDY) WU, National Taiwan University To ensure thermal safety and to avoid performance degradation from temperature regulation in 3D NoC, we propose a new temperature-traffic control framework. The framework contains the vertical throttling-based runtime thermal management (VT-RTM) scheme and the transport-layer assisted routing (TLAR) scheme. VT-RTM scheme increases the cooling speed and maintains high availability. TLAR scheme sustains the throughput of the nonstationary irregular mesh network. In our experiments, VT-RTM scheme reduces cooling time by 84% and achieves 98% network availability; the overall performance impact is around 8% of traditional schemes. TLAR scheme reduces average latency by 3570% and improves sustainable throughput by 76%. Categories and Subject Descriptors: C. [Computer Systems Organization]; C.3 [Computer Systems Organization]: Special-Purpose and Application-Based Systems--Real-time and embedded systems; C.2.3 [Computer - Communication Networks]: Network Operations--Network management; C.4 [Computer Systems Organization]: Performance of Systems General Terms: Algorithms, Design, Performance, Management Additional Key Words and Phrases: 3D IC, 3D NoC, network-on-chip, runtime thermal management, throttling, routing, nonstationary irregular mesh ACM Reference Format: Chao, C.-H., Chen, K.-C., Yin, T.-C., Lin, S.-Y., and Wu, A.-Y. 2013. Transport-layer-assisted
ACM Transactions on Embedded Computing Systems (TECS) – Association for Computing Machinery
Published: Aug 1, 2013
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