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Thermal-aware task scheduling in 3D chip multiprocessor with real-time constrained workloads

Thermal-aware task scheduling in 3D chip multiprocessor with real-time constrained workloads Thermal-Aware Task Scheduling in 3D Chip Multiprocessor with Real-Time Constrained Workloads JIAYIN LI and MEIKANG QIU, Huazhong University of Science and Technology and University of Kentucky JIAN-WEI NIU, Beihang University LAURENCE T. YANG, Huazhong University of Science and Technology and St. Francis Xavier University YONGXIN ZHU, Shanghai Jiaotong University ZHONG MING, Shenzhen University Chip multiprocessor (CMP) techniques have been implemented in embedded systems due to tremendous computation requirements. Three-dimension (3D) CMP architecture has been studied recently for integrating more functionalities and providing higher performance. The high temperature on chip is a critical issue for the 3D architecture. In this article, we propose an online thermal prediction model for 3D chips. Using this model, we propose novel task scheduling algorithms based on rotation scheduling to reduce the peak temperature on chip. We consider data dependencies, especially inter-iteration dependencies that are not well considered in most of the current thermal-aware task scheduling algorithms. Our simulation results show that our algorithms can efficiently reduce the peak temperature up to 8.1 C. Categories and Subject Descriptors: C.3 [Special-Purpose and Application-Based Systems]: real-time and embedded systems General Terms: Algorithms, Design, Performance Additional Key Words and Phrases: Thermal, peak temperature, task scheduling, real-time constraint http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png ACM Transactions on Embedded Computing Systems (TECS) Association for Computing Machinery

Thermal-aware task scheduling in 3D chip multiprocessor with real-time constrained workloads

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References (36)

Publisher
Association for Computing Machinery
Copyright
Copyright © 2013 by ACM Inc.
ISSN
1539-9087
DOI
10.1145/2423636.2423642
Publisher site
See Article on Publisher Site

Abstract

Thermal-Aware Task Scheduling in 3D Chip Multiprocessor with Real-Time Constrained Workloads JIAYIN LI and MEIKANG QIU, Huazhong University of Science and Technology and University of Kentucky JIAN-WEI NIU, Beihang University LAURENCE T. YANG, Huazhong University of Science and Technology and St. Francis Xavier University YONGXIN ZHU, Shanghai Jiaotong University ZHONG MING, Shenzhen University Chip multiprocessor (CMP) techniques have been implemented in embedded systems due to tremendous computation requirements. Three-dimension (3D) CMP architecture has been studied recently for integrating more functionalities and providing higher performance. The high temperature on chip is a critical issue for the 3D architecture. In this article, we propose an online thermal prediction model for 3D chips. Using this model, we propose novel task scheduling algorithms based on rotation scheduling to reduce the peak temperature on chip. We consider data dependencies, especially inter-iteration dependencies that are not well considered in most of the current thermal-aware task scheduling algorithms. Our simulation results show that our algorithms can efficiently reduce the peak temperature up to 8.1 C. Categories and Subject Descriptors: C.3 [Special-Purpose and Application-Based Systems]: real-time and embedded systems General Terms: Algorithms, Design, Performance Additional Key Words and Phrases: Thermal, peak temperature, task scheduling, real-time constraint

Journal

ACM Transactions on Embedded Computing Systems (TECS) – Association for Computing Machinery

Published: Feb 1, 2013

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