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Novel Through-Silicon-Via Inductor-Based On-Chip DC-DC Converter Designs in 3D ICs

Novel Through-Silicon-Via Inductor-Based On-Chip DC-DC Converter Designs in 3D ICs Novel Through-Silicon-Via Inductor-Based On-Chip DC-DC Converter Designs in 3D ICs UMAMAHESWARA RAO TIDA, Missouri University of Science and Technology CHENG ZHUO, Intel Corporation YIYU SHI, Missouri University of Science and Technology There has been a tremendous research effort in recent years to move DC-DC converters on chip for enhanced performance. However, a major limiting factor to implementing on-chip inductive DC-DC converters is the large area overhead induced by spiral inductors. Thus, we propose using through-silicon-vias (TSVs), a critical enabling technique in three-dimensional (3D) integrated systems, to implement on-chip inductors for DCDC converters. While existing literature show that TSV inductors are inferior compared with conventional spiral inductors due to substrate loss for RF applications, in this article, we demonstrate that it is not the case for DC-DC converters, which operate at relatively low frequencies. Experimental results show that by replacing conventional spiral inductors with TSV inductors, with almost the same efficiency and output voltage, up to 4.3× and 3.2× inductor area reduction can be achieved for the single-phase buck converter and the interleaved buck converter with magnetic coupling, respectively. Categories and Subject Descriptors: B.7.1 [Integrated Circuits]: Types and Design Styles--Advanced technologies, VLSI General Terms: Design, Performance Additional Key Words http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png ACM Journal on Emerging Technologies in Computing Systems (JETC) Association for Computing Machinery

Novel Through-Silicon-Via Inductor-Based On-Chip DC-DC Converter Designs in 3D ICs

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Publisher
Association for Computing Machinery
Copyright
Copyright © 2014 by ACM Inc.
ISSN
1550-4832
DOI
10.1145/2637481
Publisher site
See Article on Publisher Site

Abstract

Novel Through-Silicon-Via Inductor-Based On-Chip DC-DC Converter Designs in 3D ICs UMAMAHESWARA RAO TIDA, Missouri University of Science and Technology CHENG ZHUO, Intel Corporation YIYU SHI, Missouri University of Science and Technology There has been a tremendous research effort in recent years to move DC-DC converters on chip for enhanced performance. However, a major limiting factor to implementing on-chip inductive DC-DC converters is the large area overhead induced by spiral inductors. Thus, we propose using through-silicon-vias (TSVs), a critical enabling technique in three-dimensional (3D) integrated systems, to implement on-chip inductors for DCDC converters. While existing literature show that TSV inductors are inferior compared with conventional spiral inductors due to substrate loss for RF applications, in this article, we demonstrate that it is not the case for DC-DC converters, which operate at relatively low frequencies. Experimental results show that by replacing conventional spiral inductors with TSV inductors, with almost the same efficiency and output voltage, up to 4.3× and 3.2× inductor area reduction can be achieved for the single-phase buck converter and the interleaved buck converter with magnetic coupling, respectively. Categories and Subject Descriptors: B.7.1 [Integrated Circuits]: Types and Design Styles--Advanced technologies, VLSI General Terms: Design, Performance Additional Key Words

Journal

ACM Journal on Emerging Technologies in Computing Systems (JETC) – Association for Computing Machinery

Published: Nov 5, 2014

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