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Automated module assignment in stacked-Vdd designs for high-efficiency power delivery

Automated module assignment in stacked-Vdd designs for high-efficiency power delivery Automated Module Assignment in Stacked-Vdd Designs for High-Ef ciency Power Delivery YONG ZHAN Cadence Design Systems and SACHIN S. SAPATNEKAR University of Minnesota With aggressive reductions in feature sizes and the integration of multiple functionalities on the same die, bottlenecks due to I/O pin limitations have become a critical issue in today ™s VLSI designs, especially for 3D IC technologies. To alleviate the pin limitation problem, a stacked-Vdd circuit paradigm has recently been proposed in the literature. However, for a circuit designed using this paradigm, a signi cant amount of power may be wasted if modules are not carefully assigned to different Vdd domains. In this article, we present a partition-based algorithm for ef ciently assigning modules at the ‚oorplanning level, so as to reuse currents between Vdd domains and minimize the power wasted during the operation of the circuit. Experimental results on both 3D and 2D ICs show that compared with assigning modules to different Vdd domains using enumeration and simulated annealing, our algorithm can generate circuits with competitive power and IR noise performance, while being orders of magnitude faster. Categories and Subject Descriptors: B.7.2 [Integrated Circuits]: Design Aids General Terms: Algorithms, Design, Reliability ACM Reference Format: http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png ACM Journal on Emerging Technologies in Computing Systems (JETC) Association for Computing Machinery

Automated module assignment in stacked-Vdd designs for high-efficiency power delivery

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Publisher
Association for Computing Machinery
Copyright
Copyright © 2008 by ACM Inc.
ISSN
1550-4832
DOI
10.1145/1412587.1412591
Publisher site
See Article on Publisher Site

Abstract

Automated Module Assignment in Stacked-Vdd Designs for High-Ef ciency Power Delivery YONG ZHAN Cadence Design Systems and SACHIN S. SAPATNEKAR University of Minnesota With aggressive reductions in feature sizes and the integration of multiple functionalities on the same die, bottlenecks due to I/O pin limitations have become a critical issue in today ™s VLSI designs, especially for 3D IC technologies. To alleviate the pin limitation problem, a stacked-Vdd circuit paradigm has recently been proposed in the literature. However, for a circuit designed using this paradigm, a signi cant amount of power may be wasted if modules are not carefully assigned to different Vdd domains. In this article, we present a partition-based algorithm for ef ciently assigning modules at the ‚oorplanning level, so as to reuse currents between Vdd domains and minimize the power wasted during the operation of the circuit. Experimental results on both 3D and 2D ICs show that compared with assigning modules to different Vdd domains using enumeration and simulated annealing, our algorithm can generate circuits with competitive power and IR noise performance, while being orders of magnitude faster. Categories and Subject Descriptors: B.7.2 [Integrated Circuits]: Design Aids General Terms: Algorithms, Design, Reliability ACM Reference Format:

Journal

ACM Journal on Emerging Technologies in Computing Systems (JETC)Association for Computing Machinery

Published: Oct 1, 2008

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