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An efficient placement and routing technique for fault-tolerant distributed embedded computing

An efficient placement and routing technique for fault-tolerant distributed embedded computing This article presents an efficient technique for placement and routing of sensors/actuators and processing units in a grid network. The driver application that we present is a medical jacket, which requires an extremely high level of robustness and fault tolerance. The power consumption of such jacket is another key technological constraint. Our proposed interconnection network is a mesh of wires. A jacket made of fabric and wires would be susceptible to accidental damage via tears. By modeling the tears, we evaluate the probability of having failures on every segment of wires in our mesh interconnection network. Then, we study two problems of placement and routing in the sensor networks such that the fault tolerance is maximized while the power consumption is minimized. We develop efficient integer linear programming (ILP) formulations to address these problems and perform both placement and routing, simultaneously. This ensures that the solution is a lower bound for both problems. We evaluate the effectiveness of our proposed techniques on a variety of benchmarks. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png ACM Transactions on Embedded Computing Systems (TECS) Association for Computing Machinery

An efficient placement and routing technique for fault-tolerant distributed embedded computing

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Publisher
Association for Computing Machinery
Copyright
Copyright © 2009 by ACM Inc.
ISSN
1539-9087
DOI
10.1145/1550987.1550991
Publisher site
See Article on Publisher Site

Abstract

This article presents an efficient technique for placement and routing of sensors/actuators and processing units in a grid network. The driver application that we present is a medical jacket, which requires an extremely high level of robustness and fault tolerance. The power consumption of such jacket is another key technological constraint. Our proposed interconnection network is a mesh of wires. A jacket made of fabric and wires would be susceptible to accidental damage via tears. By modeling the tears, we evaluate the probability of having failures on every segment of wires in our mesh interconnection network. Then, we study two problems of placement and routing in the sensor networks such that the fault tolerance is maximized while the power consumption is minimized. We develop efficient integer linear programming (ILP) formulations to address these problems and perform both placement and routing, simultaneously. This ensures that the solution is a lower bound for both problems. We evaluate the effectiveness of our proposed techniques on a variety of benchmarks.

Journal

ACM Transactions on Embedded Computing Systems (TECS) – Association for Computing Machinery

Published: Jul 1, 2009

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