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Low–Dielectric Constant Insulators for Future Integrated Circuits and Packages

Low–Dielectric Constant Insulators for Future Integrated Circuits and Packages Future integrated circuits and packages will require extraordinary dielectric materials for interconnects to allow transistor advances to be translated into system-level advances. Exceedingly low-permittivity and low-loss materials are required at every level of the electronic system, from chip-level insulators to packages and printed wiring boards. In this review, the requirements and goals for future insulators are discussed followed by a summary of current state-of-the-art materials and technical approaches. Much work needs to be done for insulating materials and structures to meet future needs. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Annual Review of Chemical and Biomolecular Engineering Annual Reviews

Low–Dielectric Constant Insulators for Future Integrated Circuits and Packages

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Publisher
Annual Reviews
Copyright
Copyright © 2011 by Annual Reviews. All rights reserved
ISSN
1947-5438
eISSN
1947-5446
DOI
10.1146/annurev-chembioeng-061010-114137
pmid
22432624
Publisher site
See Article on Publisher Site

Abstract

Future integrated circuits and packages will require extraordinary dielectric materials for interconnects to allow transistor advances to be translated into system-level advances. Exceedingly low-permittivity and low-loss materials are required at every level of the electronic system, from chip-level insulators to packages and printed wiring boards. In this review, the requirements and goals for future insulators are discussed followed by a summary of current state-of-the-art materials and technical approaches. Much work needs to be done for insulating materials and structures to meet future needs.

Journal

Annual Review of Chemical and Biomolecular Engineering – Annual Reviews

Published: Jul 15, 2011

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