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This paper discusses the influence of tribology on the mechanical properties of cutting, shaping and forming silicon wafers. These processes, such as multi wire slurry sawing, diamond wire sawing, lapping and grinding, Chemical Mechanical Polishing (CMP), and dicing, utilize either a two-body or...
A new means of obtaining fine Si particles is through the use of a melt thermal treatment (MTT), where the mixing of low and high temperature alloy melts produces a fine Si structure. Modification is achieved by nuclei resulting from the degeneration of large atom clusters and some refractory...
This paper deals with the influence of hardness of work materials on flank wear, crater wear and finished surface roughness when using two types of high-speed steel (HSS) hob tool materials coated with (Al, Ti)N film. Specifically, hobbing with a minimal quantity lubrication (MQL) system is...
Evaluation of internal energy and the inter-atomic or ionic interactions in a crystal lattice usually requires precise calculation of lattice sums. This in the case of small nano-particles (as space-limited domains) presents several challenges, as conventional methods are usually valid only for...
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